News Summary

NLM Photonics, a leader in hybrid organic electro-optic (OEO) technology, is set to demonstrate its groundbreaking 1.6 Terabit DR8 photonic integrated circuit (PIC) at the OFC 50 event in San Francisco from April 1-3, 2025. This demonstration marks a significant milestone in the commercialization of hybrid OEO technology, featuring the industry’s first silicon-organic hybrid (SOH) modulator on a multi-channel PIC. NLM’s technology, developed with partners like Advanced Micro Foundry, Centera Photonics, and Enosemi, promises unprecedented performance and stability. The 1.6T PIC is designed to address the increasing bandwidth demands of AI workloads while reducing power consumption by 20-30% compared to traditional offerings. NLM’s patented Selerion™-HTX technology enables the PIC to be 40% smaller than standard silicon photonics PICs, delivering 200Gb/s per lane bandwidth. The technology aims to solve critical challenges in data center power consumption and is set to revolutionize the field of photonic integration.